What's new in DipTrace 4.3
Jul 27, 2022
- Built-in Spice simulator.
- DipTrace XML for PCB, Schematic, Component Editor and Pattern Editor.
- SMD / THT pads in PCB Layout design information.
- Custom column title for BOM, Pick and Place.
- Mouser Part Numbers have been added to the additional fields of the components.
- New and updated component libraries with popular parts from the world and Asian brands:
- Diodes (Rectifiers Arrays, Rectifiers Single, Schottky, Zener);
- IC Clock & Timing Real Time Clocks;
- IC Data Acq (ADC, DAC);
- IC Linear (Amplifiers,Comparators);
- IC Memory (FLASH, FRAM, SDRAM);
- IC MCU (Atmel AVR, ST Micro ARM);
- IC PMIC (Battery Management, Battery Chargers, Display Drivers, Gate Drivers, Motor and Fan Controllers Drivers);
- IC PMIC (Power Distribution Switches, Supervisors Controllers Monitors, Voltage References, Voltage Regulators);
- Isolators (Logic Output, Transistor Photovoltaic Output);
- Opto Emitters LED SMD;
- P&P (Filters Ferrite, TVS Diodes);
- Relays (Power, Signal, Solid State);
- Sensors (Angle Linear Position Measuring, Current, Humidity, Inertia Accelerometers, Temp Thermistors NTC/PTC);
- Switches Tactile;
- Thyristors TRIAC;
- Transistors (Arrays, NPN, PNP, MOSFET);
- Con (D-Sub, Edge Cards, Memory Inline Module, Memory Micro SD Card, Modular Jacks RJ-45);
- Con (Pluggable, RF & Coaxial SMA, RF & Coaxial U.FL, Sockets PLCC, USB 2.0, USB 3.0);
- Con Rect Headers SMD (Pitch 1.25mm Vertical Shrouded, Pitch 2.00mm Angled Shrouded);
- Con Rect Headers THT ( Pitch 2.50mm Vertical Shrouded, Pitch 3.00mm Angled and Vertical Shrouded).
- Basic components library (free assembly in JLCPCB):
- Basic Parts JLCPCB.
- New STEP models for patterns of the following libraries:
- Con (Edge Cards, Memory, Sockets PLCC, USB).
New in DipTrace 4.2.0.0 (Nov 2, 2021)
- New XML format for component and pattern libraries.
- Environment Variables in all paths, support of related project/program paths for libraries/models/pictures.
- Ability to make a portable version of the program.
- Pause routing (allows editing other traces/vias and resuming routing in one key press).
- Continue routing option in net merge/move pad submenu.
- Radial / Polar Placement of design objects in PCB Layout and Pattern Editor.
- Group is aligned as a single object in the Align Objects feature.
- Edge rails for a single board option.
- Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap.
- Side and isometric view buttons in 3D preview dialogs.
- Display/Find vias by style on the layout.
- Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).
- LCSC Part Numbers have been added to the additional fields of the components (used by a Chinese PCB manufacturer – JLCPCB).
- Bug fixes.
- New and updated pattern libraries:
- Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
- Con USB (2.0, 3.0);
- DFN (3 Pins, 4 Pins);
- DPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm);
- Diodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL);
- Fuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk);
- LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical);
- Modules;
- Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others);
- SOT23-3 (Pitch 0.50mm, 0.65mm);
- SOT143 (Pitch 1.30mm, 1.90mm, 1.92mm);
- Transistors DFN 3 Pins;
- Switches Toggle;
- Uncategorized.
- New and updated component libraries:
- Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
- Con USB (2.0, 3.0);
- IC MPU MCU Modules;
- Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet);
- Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable);
- RF Modules;
- Sensors Optical (Photodiodes, Phototransistors, Optosensors, IC Optosensors, Photoconductive Cells);
- Sensors Temperature (Thermistors PTC, RTD, Analog Output, Digital Output, Voltage Current Output, Thermostats);
- Sensors Inertia (Accelerometers, Gyroscopes, Tilt Inclinometers);
- Sensors (Magnetic, Pressure, Media Gas, Humidity, Encoders, Capacitive Touch Proximity, Image Camera, Angle Linear Position Measuring).
New in DipTrace 4.1.3.0 (Jun 10, 2021)
- Suppliers and Prices in BOM.
- KiCAD import has been improved (KiCAD v5.99 support).
- Sprint Layout 6.0 Import (Text IO).
- New IPC-7351 libraries:
- Switches (DIP, Limit, Lever, Snap Action, Pushbutton, Rotary, Slide, Tactile);
- BGA Pitch 1.5mm;
- DPAK Pitch (0.85mm, 1.4mm, 1.75mm, 2mm, 2.55mm, 4.57mm, 5.08mm, 5.45mm);
- SOT23-4 Pitch (0.65mm, 0.95mm);
- SOT223-3 Pitch (1.5mm, 2.3mm);
- SIP Pitch (1.25mm, 1.27mm);
- SOL Pitch 2.54mm;
- TO-220 Pitch (1.27mm, 1.3mm);
- Objects Logo;
- Objects Pin Label;
- Objects Polarity Marker.
New in DipTrace 4.1.2.0 (Mar 23, 2021)
- Downloading 3D model for SnapEDA parts, polishing SnapEDA feature.
- Checking component prices and availability with direct links to suppliers.
- IPC-7351 Libraries of Con Memory Cards.
- Minor changes and bug fixes.
New in DipTrace 4.1.1.0 (Mar 23, 2021)
- SnapEDA Integration: free access to over 10 million DipTrace parts in a few clicks right from DipTrace UI.
- IPC-7351 libraries of transformers.
- Minor changes and bug fixes.
New in DipTrace 4.1 (Feb 9, 2021)
- Improved panelizing: V-Score and Tab Routing with mouse bites.
- Improved BOM, BOM in PCB Layout, Interactive BOM: integrated and HTML export.
- Improved Pick and Place: Center X/Y by component outline and terminals if exist, package height, updated dialog window.
- Assembly variants for BOM and Pick and Place.
- Improved Drill Size Report.
- Automatic update of report tables in PCB (BOM, Pick and Place, Drill Size, Layer Stack).
- Table rows and related components for report tables are highlighted.
- Raster pictures in PCB, improved raster pictures in Schematic.
- "Do not rotate marking with component" option.
- Improved trace editing: sharp angles are optimized, moving orthogonal trace with related 45 degree segments if necessary.
- Highlight copper pour islands and traces when highlight any trace or copper pour border.
- Align components and texts by other components and texts while moving.
- Resize of all panels (layers/properties/design manager, route, place component, etc) by mouse drag and drop.
- Bulk update of patterns in component libraries.
- Keep all pins of IPC-7351 3D model, not depending on pattern pads (option).
- Pattern description is displayed in Component Editor, Schematic and PCB.
- Basic part swap in Schematic.
- Remove ratline while deleting trace (option).
- 3D preview: Vector pictures in mask layer.
- Import/Export Improvements for DXF, Eagle, Altium ASCII, P-CAD ASCII.
- IPC-7351 Pattern Generator changes in CQFP, DFN 2 Pins, DFN 3 Pins, DFN 4 Pins, SOD, SODFL, Radial (Round LED), Radial (Rectangular LED), Radial (Disk), Radial (Disk, Offset Leads).
- IPC-7351 automatic 3D models for the following families:
- Crystal(HC-49); Crystal; Chip Array, 2 Side Concave; Chip Array, 4 Side Concave;
- Oscillator, Corner Concave; Oscillator, Side Concave;
- Chip Array, 2 Side Flat; Chip Array, 4 Side Flat; LCC;
- Chip, Side Concave(2, 4 Pins); Chip Array, 2 Side Convex;
- DIP Socket; SIP; TO Cylindrical; Radial (Dipped, Round); Radial (Dipped, Rectangular); Radial (Dipped, Rectangular Offset Leads);
- Radial (Disk); Radial (Disk, Offset Leads); Radial (Inductor); Radial (Molded).
- New libraries:
- Con HDMI, Con Sockets DIP, Objects Fiducial, Objects Hardware Inch, Objects Hardware Metric,
- Objects Jumper, Objects Lead Hole Pad, Objects Panelizing, Objects Testpoint, Objects Wire.
- Old libraries redesigned for IPC-7351:
- Con Rect Headers, Con Rect Wire to Board, Con USB, Con Vacuum Tubes, Inductors, Potentiometers.
New in DipTrace 4.0 (May 21, 2020)
- IPC-7351 standard pattern type
- pattern is generated automatically by IPC-7351 generator integrated into Pattern Editor;
- 3D model is generated on the fly in Pattern Editor and PCB Layout.
- New IPC-7351 libraries.
- UI has been optimized for 4k monitors.
- Mac OS 10.15 Catalina support.
- RoundRect and D-shape pads.
- Pad shape can be shifted from pad hole center.
- Teardrops for pads, vias, trace width change and T-junctions.
- Rotating pads by any angle without changing to polygon.
- Rotating component by any angle without changing it.
- Pad terminals.
- Segmented paste mask, solder mask by paste mask.
- Solder mask and paste mask of pads are visible in the design area and can be printed.
- Fiducial object in PCB and Pattern Editor.
- Pattern Editor has a layer panel similar to PCB Layout.
- Both Pattern Editor and PCB Layout layer panels have configurable layer order and visibility.
- Courtyard layer, DRC does not allow courtyard region to be overlayed (touch is allowed).
- Component outline layer (3D model can be built by component outline).
- Configurable Silk to Pad clearance in DRC.
- Remove silk from pads/holes/mask wizard in Pattern Editor.
- Place outline wizard in Pattern Editor.
- Similar pad numbers are allowed (in this case pads are connected inside a pattern, @ symbol before or after pad number allows to avoid warning).
- Two types of internal component connections are possible
- one of pads should be connected or internal connection can be used as jumper for the net;
- all pads should be connected.
- Manual routing improvements
- Routing with static vias option;
- Tab key can be used to toggle between selection of a segment, trace and net;
- Del key is used for unrouting selected traces (node to node) instead of deleting net;
- Delete Net option has been added to net submenu.
- 3 ways to build and edit arcs (3 points, center-radius-angles, start-end-radius).
- Any set of shapes can be converted to a board outline (you can place arcs, lines, poly-lines as you wish, connect their ends and convert the set to a board outline).
- Updated properties dialogs for all shapes (now can be edited by dimensions).
- Obround shapes instead of ellipses in all programs.
- Snap to other objects key points when building/editing shapes, board and copper pour.
- Multi-line text.
- - “~” symbol is allowed in text (double ~~).
- Text and pictures can be rotated by any angle.
- Pictures are now vectorized and saved together with a design file.
- It is possible to etch text or picture/logo in the copper pour.
- Anchor point + Left-Center-Right, Top-Center-Bottom alignment is used for text, markings, pictures and while editing shapes.
- Cut the right angle of the shape option.
- New Component marking system in Schematic and PCB Layout
- any number of markings can be displayed (display property is available for each field, including additional);
- free angle rotation and alignment;
- separate marking settings for assembly layer in PCB;
- custom marking font by the component;
- text with parameter property placed in Pattern/ Component Editor is counted as pattern marking (PCB/Schematic do not add additional text);
- font settings can be applied to markings placed in Component/Pattern Editor;
- move tool (F10) allows to move/rotate any text object inside a component directly in Schematic/PCB.
- Pattern origin is shown as cross + circle (options) and can be displayed by layers.
- 3 ways of building 3D models of the pattern (by file, by component outline and by IPC-7351 standard).
- Filter can be stopped at any search stage, results are displayed in real-time while searching components.
- Component properties dialog is redesigned to allow display and edit all additional fields at once.
- Name description, unique name and manufacturer fields have been added to the pattern.
- Free resizing of library/component list and additional fields in Component/Pattern Editors.
- Pattern shape precision has been improved, recounting pattern shapes by borders when you change the number of pads/dimensions in Pattern Editor.
- Pad to copper pour thermals are rotated by pad/component angle.
- Selecting object and opening its submenu from Design Manager in Schematic and PCB (right click on the item in the Design Manager).
- Groups in Component and Pattern Editors, similar to Schematic and PCB.
- Measure tool in Schematic and Component Editor.
- Properties dialog windows may change locked objects after confirmation.
- Updating PCB from Schematic keeps locked components non-existent in Schematic.
- Export all Gerber and Drill files into a zip archive with a single click.
- Configurable default filenames for drill export.
New in DipTrace 3.3.1 (Feb 21, 2019)
- Zoom on Undo/Redo - options added, main zoom mode has been corrected.
- Routing by Numpad option (NumLock should be ON).
- Grid Snap option - allows to turn off snap, but keep grid visible.
- Status Bar now displays current mode, current view (normal/mirrored) and grid snap.
- Several bugs have been found and fixed - see details.
New in DipTrace 3.3 (Feb 21, 2019)
- Configurable precision for all values by units, configurable grid precision.
- Redesigned Undo/Redo System in Schematic and PCB Layout
- Improved Hide/Display Wire feature in Schematic
- UI: All ComboBoxes have been replaced with DropDownLists.
- Option: detailed hint in PCB Layout and Pattern Editor (shows pad/via/hole dimensions).
- KiCAD Schematic and PCB import.
- KiCAD Library and Footprint import.
- Eagle Schematic and PCB XML export.
- Eagle Library XML export.
- Polishing of existing features.
- Improved manual routing:
- "follow design rules" option (doesn't allow violations)
- redesigned routing modes
- orthogonal segments
- fix single segment option
- via preview at the end of routed segment
New in DipTrace 3.2 (Oct 30, 2017)
- DRC same net clearance check (Trace to Trace, SMD to Pad, SMD to Via, SMD to SMD).
- Improved highlight and selection of objects in the PCB Layout (traces and all other objects under footprints are highlighted in the default mode).
- Polishing of length matching and meander features.
- Storing common solder mask swell and paste mask shrink with the project file.
- Always open/soldered option in custom mask/paste settings for pads and vias.
- Rotate Group and Flip Group commands in the Component and Pattern Editors.
- Additional fields in Pick and Place, tab divider in text files for BOM and Pick and Place.
New in DipTrace 3.1 (Jun 6, 2017)
- Length matching rules.
- Real-time length comparison table.
- Layer stackup table.
- Using layer stackup and pad signal delay for trace length and differential pair phase calculation.
- Meander tool for any trace, easy resizing and moving of meanders.
- Improved phase tune tool.
- Align objects.
- Switching measurement units with a shortcut in any dialog box (Shift+U by default).
- Hotkeys for selecting sheets in Schematic and for the measuring tool in the Pattern Editor.
- Moving all selected trace segments simultaneously (bus editing).
- Permanent net highlight option.
- Altium ASCII import (Schematic, PCB, libraries).
- Eagle XML import (Schematic, PCB, libraries).
- ODB++ output - version 8.1 added.
- 11,813 new components and 345 new patterns.
- 1,726 new 3D models.
New in DipTrace 3.0.0.1 (Apr 29, 2016)
- Differential pairs:
- Define differential pair and its rules;
- Automatic or manual defining of paired pads;
- Paired routing and editing of differential pair;
- Single-track differential pair routing and editing;
- Phase tune tool (place custom / regular size meanders);
- Real-time control of phase and length tolerance;
- Differential pair manager;
- Support of differential pairs for external auto-routers, recognition of paired traces.
- Custom user-defined keyboard shortcuts for tools and dialogs.
- ODB++ (version 7.0) manufacturing output.
- Gerber X2 manufacturing output.
- DRC rule details (easy editing of routing constraints).
- Tree view of 3D models in All Models list, sorted by categories (folders).
- Overall speed and memory optimization for large designs.
- Optimized UI fonts.
- 8143 new components.
- 5694 new STEP models for 3D.
New in DipTrace 2.4 (Aug 7, 2014)
- Redesigned UI.
- New library management system:
- Library Groups;
- Standard and user libraries are separated to different groups, standard libraries can not be changed by user;
- Project libraries and design cache;
- Cross-module Library Manager;
- Dynamic update of library groups, group content, active library / component between programs;
- Library groups and libraries are visible in all dialog boxes where libraries are used (Library Setup - no more add / delete buttons and separate lists);
- Filter feature with customizable number of parameters (search by current library, group or all libraries).
- Unicode support in all program objects, files and UI elements.
- STEP export of PCB 3D model.
- STEP and IGES import of package 3D models.
- IPC-D-356A Netlist Export.
- BSDL Pinlist Import in Component Editor.
- Updated import dialogs of third-party schematics and net-lists, remembering of attached patterns.
- Printing multipage schematic as single document.
- Updated Title Block Editor, "Attached Pattern" tool, editing of polygonal pads.
- Redesigned Properties panel (on design area) for Component and Pattern editors.
- Zooming / Panning with mouse wheel in all print / import / export panels with preview feature.
- Update all Copper Pours and algorithm optimizations (approx 3x-5x speed-up).
- Correct side changing for groups in PCB Layout.