DipTrace Changelog

What's new in DipTrace 4.3

Jul 27, 2022
  • Built-in Spice simulator.
  • DipTrace XML for PCB, Schematic, Component Editor and Pattern Editor.
  • SMD / THT pads in PCB Layout design information.
  • Custom column title for BOM, Pick and Place.
  • Mouser Part Numbers have been added to the additional fields of the components.
  • New and updated component libraries with popular parts from the world and Asian brands:
  • Diodes (Rectifiers Arrays, Rectifiers Single, Schottky, Zener);
  • IC Clock & Timing Real Time Clocks;
  • IC Data Acq (ADC, DAC);
  • IC Linear (Amplifiers,Comparators);
  • IC Memory (FLASH, FRAM, SDRAM);
  • IC MCU (Atmel AVR, ST Micro ARM);
  • IC PMIC (Battery Management, Battery Chargers, Display Drivers, Gate Drivers, Motor and Fan Controllers Drivers);
  • IC PMIC (Power Distribution Switches, Supervisors Controllers Monitors, Voltage References, Voltage Regulators);
  • Isolators (Logic Output, Transistor Photovoltaic Output);
  • Opto Emitters LED SMD;
  • P&P (Filters Ferrite, TVS Diodes);
  • Relays (Power, Signal, Solid State);
  • Sensors (Angle Linear Position Measuring, Current, Humidity, Inertia Accelerometers, Temp Thermistors NTC/PTC);
  • Switches Tactile;
  • Thyristors TRIAC;
  • Transistors (Arrays, NPN, PNP, MOSFET);
  • Con (D-Sub, Edge Cards, Memory Inline Module, Memory Micro SD Card, Modular Jacks RJ-45);
  • Con (Pluggable, RF & Coaxial SMA, RF & Coaxial U.FL, Sockets PLCC, USB 2.0, USB 3.0);
  • Con Rect Headers SMD (Pitch 1.25mm Vertical Shrouded, Pitch 2.00mm Angled Shrouded);
  • Con Rect Headers THT ( Pitch 2.50mm Vertical Shrouded, Pitch 3.00mm Angled and Vertical Shrouded).
  • Basic components library (free assembly in JLCPCB):
  • Basic Parts JLCPCB.
  • New STEP models for patterns of the following libraries:
  • Con (Edge Cards, Memory, Sockets PLCC, USB).

New in DipTrace 4.2.0.0 (Nov 2, 2021)

  • New XML format for component and pattern libraries.
  • Environment Variables in all paths, support of related project/program paths for libraries/models/pictures.
  • Ability to make a portable version of the program.
  • Pause routing (allows editing other traces/vias and resuming routing in one key press).
  • Continue routing option in net merge/move pad submenu.
  • Radial / Polar Placement of design objects in PCB Layout and Pattern Editor.
  • Group is aligned as a single object in the Align Objects feature.
  • Edge rails for a single board option.
  • Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap.
  • Side and isometric view buttons in 3D preview dialogs.
  • Display/Find vias by style on the layout.
  • Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).
  • LCSC Part Numbers have been added to the additional fields of the components (used by a Chinese PCB manufacturer – JLCPCB).
  • Bug fixes.
  • New and updated pattern libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • DFN (3 Pins, 4 Pins);
  • DPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm);
  • Diodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL);
  • Fuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk);
  • LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical);
  • Modules;
  • Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others);
  • SOT23-3 (Pitch 0.50mm, 0.65mm);
  • SOT143 (Pitch 1.30mm, 1.90mm, 1.92mm);
  • Transistors DFN 3 Pins;
  • Switches Toggle;
  • Uncategorized.
  • New and updated component libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • IC MPU MCU Modules;
  • Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet);
  • Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable);
  • RF Modules;
  • Sensors Optical (Photodiodes, Phototransistors, Optosensors, IC Optosensors, Photoconductive Cells);
  • Sensors Temperature (Thermistors PTC, RTD, Analog Output, Digital Output, Voltage Current Output, Thermostats);
  • Sensors Inertia (Accelerometers, Gyroscopes, Tilt Inclinometers);
  • Sensors (Magnetic, Pressure, Media Gas, Humidity, Encoders, Capacitive Touch Proximity, Image Camera, Angle Linear Position Measuring).

New in DipTrace 4.1.3.0 (Jun 10, 2021)

  • Suppliers and Prices in BOM.
  • KiCAD import has been improved (KiCAD v5.99 support).
  • Sprint Layout 6.0 Import (Text IO).
  • New IPC-7351 libraries:
  • Switches (DIP, Limit, Lever, Snap Action, Pushbutton, Rotary, Slide, Tactile);
  • BGA Pitch 1.5mm;
  • DPAK Pitch (0.85mm, 1.4mm, 1.75mm, 2mm, 2.55mm, 4.57mm, 5.08mm, 5.45mm);
  • SOT23-4 Pitch (0.65mm, 0.95mm);
  • SOT223-3 Pitch (1.5mm, 2.3mm);
  • SIP Pitch (1.25mm, 1.27mm);
  • SOL Pitch 2.54mm;
  • TO-220 Pitch (1.27mm, 1.3mm);
  • Objects Logo;
  • Objects Pin Label;
  • Objects Polarity Marker.

New in DipTrace 4.1.2.0 (Mar 23, 2021)

  • Downloading 3D model for SnapEDA parts, polishing SnapEDA feature.
  • Checking component prices and availability with direct links to suppliers.
  • IPC-7351 Libraries of Con Memory Cards.
  • Minor changes and bug fixes.

New in DipTrace 4.1.1.0 (Mar 23, 2021)

  • SnapEDA Integration: free access to over 10 million DipTrace parts in a few clicks right from DipTrace UI.
  • IPC-7351 libraries of transformers.
  • Minor changes and bug fixes.

New in DipTrace 4.1 (Feb 9, 2021)

  • Improved panelizing: V-Score and Tab Routing with mouse bites.
  • Improved BOM, BOM in PCB Layout, Interactive BOM: integrated and HTML export.
  • Improved Pick and Place: Center X/Y by component outline and terminals if exist, package height, updated dialog window.
  • Assembly variants for BOM and Pick and Place.
  • Improved Drill Size Report.
  • Automatic update of report tables in PCB (BOM, Pick and Place, Drill Size, Layer Stack).
  • Table rows and related components for report tables are highlighted.
  • Raster pictures in PCB, improved raster pictures in Schematic.
  • "Do not rotate marking with component" option.
  • Improved trace editing: sharp angles are optimized, moving orthogonal trace with related 45 degree segments if necessary.
  • Highlight copper pour islands and traces when highlight any trace or copper pour border.
  • Align components and texts by other components and texts while moving.
  • Resize of all panels (layers/properties/design manager, route, place component, etc) by mouse drag and drop.
  • Bulk update of patterns in component libraries.
  • Keep all pins of IPC-7351 3D model, not depending on pattern pads (option).
  • Pattern description is displayed in Component Editor, Schematic and PCB.
  • Basic part swap in Schematic.
  • Remove ratline while deleting trace (option).
  • 3D preview: Vector pictures in mask layer.
  • Import/Export Improvements for DXF, Eagle, Altium ASCII, P-CAD ASCII.
  • IPC-7351 Pattern Generator changes in CQFP, DFN 2 Pins, DFN 3 Pins, DFN 4 Pins, SOD, SODFL, Radial (Round LED), Radial (Rectangular LED), Radial (Disk), Radial (Disk, Offset Leads).
  • IPC-7351 automatic 3D models for the following families:
  • Crystal(HC-49); Crystal; Chip Array, 2 Side Concave; Chip Array, 4 Side Concave;
  • Oscillator, Corner Concave; Oscillator, Side Concave;
  • Chip Array, 2 Side Flat; Chip Array, 4 Side Flat; LCC;
  • Chip, Side Concave(2, 4 Pins); Chip Array, 2 Side Convex;
  • DIP Socket; SIP; TO Cylindrical; Radial (Dipped, Round); Radial (Dipped, Rectangular); Radial (Dipped, Rectangular Offset Leads);
  • Radial (Disk); Radial (Disk, Offset Leads); Radial (Inductor); Radial (Molded).
  • New libraries:
  • Con HDMI, Con Sockets DIP, Objects Fiducial, Objects Hardware Inch, Objects Hardware Metric,
  • Objects Jumper, Objects Lead Hole Pad, Objects Panelizing, Objects Testpoint, Objects Wire.
  • Old libraries redesigned for IPC-7351:
  • Con Rect Headers, Con Rect Wire to Board, Con USB, Con Vacuum Tubes, Inductors, Potentiometers.

New in DipTrace 4.0 (May 21, 2020)

  • IPC-7351 standard pattern type
  • pattern is generated automatically by IPC-7351 generator integrated into Pattern Editor;
  • 3D model is generated on the fly in Pattern Editor and PCB Layout.
  • New IPC-7351 libraries.
  • UI has been optimized for 4k monitors.
  • Mac OS 10.15 Catalina support.
  • RoundRect and D-shape pads.
  • Pad shape can be shifted from pad hole center.
  • Teardrops for pads, vias, trace width change and T-junctions.
  • Rotating pads by any angle without changing to polygon.
  • Rotating component by any angle without changing it.
  • Pad terminals.
  • Segmented paste mask, solder mask by paste mask.
  • Solder mask and paste mask of pads are visible in the design area and can be printed.
  • Fiducial object in PCB and Pattern Editor.
  • Pattern Editor has a layer panel similar to PCB Layout.
  • Both Pattern Editor and PCB Layout layer panels have configurable layer order and visibility.
  • Courtyard layer, DRC does not allow courtyard region to be overlayed (touch is allowed).
  • Component outline layer (3D model can be built by component outline).
  • Configurable Silk to Pad clearance in DRC.
  • Remove silk from pads/holes/mask wizard in Pattern Editor.
  • Place outline wizard in Pattern Editor.
  • Similar pad numbers are allowed (in this case pads are connected inside a pattern, @ symbol before or after pad number allows to avoid warning).
  • Two types of internal component connections are possible
  • one of pads should be connected or internal connection can be used as jumper for the net;
  • all pads should be connected.
  • Manual routing improvements
  • Routing with static vias option;
  • Tab key can be used to toggle between selection of a segment, trace and net;
  • Del key is used for unrouting selected traces (node to node) instead of deleting net;
  • Delete Net option has been added to net submenu.
  • 3 ways to build and edit arcs (3 points, center-radius-angles, start-end-radius).
  • Any set of shapes can be converted to a board outline (you can place arcs, lines, poly-lines as you wish, connect their ends and convert the set to a board outline).
  • Updated properties dialogs for all shapes (now can be edited by dimensions).
  • Obround shapes instead of ellipses in all programs.
  • Snap to other objects key points when building/editing shapes, board and copper pour.
  • Multi-line text.
  • - “~” symbol is allowed in text (double ~~).
  • Text and pictures can be rotated by any angle.
  • Pictures are now vectorized and saved together with a design file.
  • It is possible to etch text or picture/logo in the copper pour.
  • Anchor point + Left-Center-Right, Top-Center-Bottom alignment is used for text, markings, pictures and while editing shapes.
  • Cut the right angle of the shape option.
  • New Component marking system in Schematic and PCB Layout
  • any number of markings can be displayed (display property is available for each field, including additional);
  • free angle rotation and alignment;
  • separate marking settings for assembly layer in PCB;
  • custom marking font by the component;
  • text with parameter property placed in Pattern/ Component Editor is counted as pattern marking (PCB/Schematic do not add additional text);
  • font settings can be applied to markings placed in Component/Pattern Editor;
  • move tool (F10) allows to move/rotate any text object inside a component directly in Schematic/PCB.
  • Pattern origin is shown as cross + circle (options) and can be displayed by layers.
  • 3 ways of building 3D models of the pattern (by file, by component outline and by IPC-7351 standard).
  • Filter can be stopped at any search stage, results are displayed in real-time while searching components.
  • Component properties dialog is redesigned to allow display and edit all additional fields at once.
  • Name description, unique name and manufacturer fields have been added to the pattern.
  • Free resizing of library/component list and additional fields in Component/Pattern Editors.
  • Pattern shape precision has been improved, recounting pattern shapes by borders when you change the number of pads/dimensions in Pattern Editor.
  • Pad to copper pour thermals are rotated by pad/component angle.
  • Selecting object and opening its submenu from Design Manager in Schematic and PCB (right click on the item in the Design Manager).
  • Groups in Component and Pattern Editors, similar to Schematic and PCB.
  • Measure tool in Schematic and Component Editor.
  • Properties dialog windows may change locked objects after confirmation.
  • Updating PCB from Schematic keeps locked components non-existent in Schematic.
  • Export all Gerber and Drill files into a zip archive with a single click.
  • Configurable default filenames for drill export.

New in DipTrace 3.3.1 (Feb 21, 2019)

  • Zoom on Undo/Redo - options added, main zoom mode has been corrected.
  • Routing by Numpad option (NumLock should be ON).
  • Grid Snap option - allows to turn off snap, but keep grid visible.
  • Status Bar now displays current mode, current view (normal/mirrored) and grid snap.
  • Several bugs have been found and fixed - see details.

New in DipTrace 3.3 (Feb 21, 2019)

  • Configurable precision for all values by units, configurable grid precision.
  • Redesigned Undo/Redo System in Schematic and PCB Layout
  • Improved Hide/Display Wire feature in Schematic
  • UI: All ComboBoxes have been replaced with DropDownLists.
  • Option: detailed hint in PCB Layout and Pattern Editor (shows pad/via/hole dimensions).
  • KiCAD Schematic and PCB import.
  • KiCAD Library and Footprint import.
  • Eagle Schematic and PCB XML export.
  • Eagle Library XML export.
  • Polishing of existing features.
  • Improved manual routing:
  • "follow design rules" option (doesn't allow violations)
  • redesigned routing modes
  • orthogonal segments
  • fix single segment option
  • via preview at the end of routed segment

New in DipTrace 3.2 (Oct 30, 2017)

  • DRC same net clearance check (Trace to Trace, SMD to Pad, SMD to Via, SMD to SMD).
  • Improved highlight and selection of objects in the PCB Layout (traces and all other objects under footprints are highlighted in the default mode).
  • Polishing of length matching and meander features.
  • Storing common solder mask swell and paste mask shrink with the project file.
  • Always open/soldered option in custom mask/paste settings for pads and vias.
  • Rotate Group and Flip Group commands in the Component and Pattern Editors.
  • Additional fields in Pick and Place, tab divider in text files for BOM and Pick and Place.

New in DipTrace 3.1 (Jun 6, 2017)

  • Length matching rules.
  • Real-time length comparison table.
  • Layer stackup table.
  • Using layer stackup and pad signal delay for trace length and differential pair phase calculation.
  • Meander tool for any trace, easy resizing and moving of meanders.
  • Improved phase tune tool.
  • Align objects.
  • Switching measurement units with a shortcut in any dialog box (Shift+U by default).
  • Hotkeys for selecting sheets in Schematic and for the measuring tool in the Pattern Editor.
  • Moving all selected trace segments simultaneously (bus editing).
  • Permanent net highlight option.
  • Altium ASCII import (Schematic, PCB, libraries).
  • Eagle XML import (Schematic, PCB, libraries).
  • ODB++ output - version 8.1 added.
  • 11,813 new components and 345 new patterns.
  • 1,726 new 3D models.

New in DipTrace 3.0.0.1 (Apr 29, 2016)

  • Differential pairs:
  • Define differential pair and its rules;
  • Automatic or manual defining of paired pads;
  • Paired routing and editing of differential pair;
  • Single-track differential pair routing and editing;
  • Phase tune tool (place custom / regular size meanders);
  • Real-time control of phase and length tolerance;
  • Differential pair manager;
  • Support of differential pairs for external auto-routers, recognition of paired traces.
  • Custom user-defined keyboard shortcuts for tools and dialogs.
  • ODB++ (version 7.0) manufacturing output.
  • Gerber X2 manufacturing output.
  • DRC rule details (easy editing of routing constraints).
  • Tree view of 3D models in All Models list, sorted by categories (folders).
  • Overall speed and memory optimization for large designs.
  • Optimized UI fonts.
  • 8143 new components.
  • 5694 new STEP models for 3D.

New in DipTrace 2.4 (Aug 7, 2014)

  • Redesigned UI.
  • New library management system:
  • Library Groups;
  • Standard and user libraries are separated to different groups, standard libraries can not be changed by user;
  • Project libraries and design cache;
  • Cross-module Library Manager;
  • Dynamic update of library groups, group content, active library / component between programs;
  • Library groups and libraries are visible in all dialog boxes where libraries are used (Library Setup - no more add / delete buttons and separate lists);
  • Filter feature with customizable number of parameters (search by current library, group or all libraries).
  • Unicode support in all program objects, files and UI elements.
  • STEP export of PCB 3D model.
  • STEP and IGES import of package 3D models.
  • IPC-D-356A Netlist Export.
  • BSDL Pinlist Import in Component Editor.
  • Updated import dialogs of third-party schematics and net-lists, remembering of attached patterns.
  • Printing multipage schematic as single document.
  • Updated Title Block Editor, "Attached Pattern" tool, editing of polygonal pads.
  • Redesigned Properties panel (on design area) for Component and Pattern editors.
  • Zooming / Panning with mouse wheel in all print / import / export panels with preview feature.
  • Update all Copper Pours and algorithm optimizations (approx 3x-5x speed-up).
  • Correct side changing for groups in PCB Layout.