14 DAY TRIAL // Chipworks has just discovered after tearing down multiple iPhone 6s and 6s Plus units that Apple uses two versions of their A9 SoC (system on a chip) with different sized dies in their new iPhone models.
As Apple stated on their website, the new A9 chips should provide 90% more graphics performance and 70% more processor performance when compared to the older A8 SoC.
The A9 is available in the new iPhone 6s and iPhone 6s Plus and it is a dual-core 1.85 GHz 64-bit ARM-based chip that comes with an embedded M9 motion coprocessor designed to control the compass, barometer, gyroscope and accelerometer, as well as controlling the iOS Siri virtual assistant.
Moreover, the A9 also features an image processor that makes it easier for the iOS device to run graphics intensive applications.
According to Chipworks' report, the two versions of A9 available in the just-released iPhone 6s and 6s Plus differ in sizes, with Samsung's APL0898 having a 96 mm2 die and TSMC's APL1022 having a 104.5 mm2.
The different sizes might be explained by previous rumors saying that Samsung will use a 14-nanometer FinFET manufacturing process while TSMC would manufacture the A9 chips using a 16-nanometer technology.
Chipworks also said that they want to further analyze the difference between the two types of chips available in iPhone 6s and 6s Plus devices, using a combination of decapsulation and cross-sectioning techniques.
