14 DAY TRIAL // Apple’s next-generation iPhones will employ flexible printed circuit boards, or FPCBs, from Flexium Interconnect, Zhen Ding Technology, and Career Technology, according to sources in the industry.
Cited by DigiTimes, these sources reportedly said that the three manufacturers have “cut into the supply chain for Apple's next-generation iPhone devices slated for release in late September or early October.”
Those are the rumored budget (plastic) iPhone and the next-generation iPhone 5S.
The trio are reportedly “gearing up for mass production for the new models in July and August.” Which means Apple will launch the new phones in September, or October the latest.
It isn’t clear why Apple would require flexible PCBs in its iPhone, unless the phone is meant to be bent.
Another theory is that the DigiTimes report is referring to the flex cables that connect various components inside the phone (such as the battery, the sensors, and the cameras).